Datasheet Texas Instruments TNETV3525INECBB — Даташит

Производитель	Texas Instruments
Серия	OMAP3525
Модель	TNETV3525INECBB

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Комплекты разработчика и оценочные наборы

• Evaluation Modules & Boards: TMDSEVM3530
  OMAP35x Evaluation Module (EVM)
  Статус продукта: В производстве (Рекомендуется для новых разработок)
  
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• JTAG Emulators/ Analyzers: TMDSEMU200-U
  XDS200 USB Debug Probe
  Статус продукта: В производстве (Рекомендуется для новых разработок)
  
• JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
  XDS560v2 System Trace USB & Ethernet Debug Probe
  Статус продукта: В производстве (Рекомендуется для новых разработок)
  
• JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
  XDS560v2 System Trace USB Debug Probe
  Статус продукта: В производстве (Рекомендуется для новых разработок)
  

Application Notes

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  OMAP35x 0.65mm Pitch Layout Methods (Rev. B)
  PDF, 372 Кб, Версия: B, Файл опубликован: 26 июн 2008
  It is easy to see from the unique look that the OMAP35x parts have a very unusual footprint. The OMAP35x ball grid array is designed with new technology called the Via Channel array which makes significant printed circuit board (PCB) cost savings possible. If the PCB is routed correctly this cost savings can be substantial. This application report explains how this is possible and shows several
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  OMAP3530/25/15/03 CBB CBC & CUS Reflow Profiles
  PDF, 27 Кб, Файл опубликован: 13 ноя 2009
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://wiki.davincidsp.com/index.php/OMAP3_CBB_CBC_CUS_Reflow_Profiles

  Reflow profiles are dependent on numerous factors including package type number of components bo

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  OMAP35x Linux PSP Data Sheet
  PDF, 1.6 Мб, Файл опубликован: 16 окт 2009
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  Powering OMAP3 With TPS65023: Design-In Guide (Rev. B)
  PDF, 181 Кб, Версия: B, Файл опубликован: 2 мар 2009
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  OMAP35x to AM35x Hardware Migration Guide
  PDF, 19 Кб, Файл опубликован: 24 май 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://processors.wiki.ti.com/index.php/OMAP35x_to_AM35x_Hardware_Migration_Guide.

  This article describes hardware device considerations to migrate a design

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  OMAP35x to AM37x Hardware Migration Guide
  PDF, 37 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

  The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

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  PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
  PDF, 6.7 Мб, Версия: B, Файл опубликован: 13 июн 2009
  Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
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  PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
  PDF, 2.4 Мб, Версия: A, Файл опубликован: 1 ноя 2013
  Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

  PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

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  PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
  PDF, 1.2 Мб, Файл опубликован: 23 июн 2010
  Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
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  PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
  PDF, 2.0 Мб, Файл опубликован: 23 июн 2010
  Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

  Fine-pitch PCB design is a team effort and may require more than

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  Introduction to TMS320C6000 DSP Optimization
  PDF, 535 Кб, Файл опубликован: 6 окт 2011
  The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

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Классификация производителя

• Semiconductors > Processors > Digital Signal Processors > Media Processors > OMAP Processors