Корпус Linear Technology 3x3 UTDFN-10 — Даташит

KD Package
10-Lead Plastic UTDFN (3mm Г— 3mm)
(Reference LTC DWG #05-08-1739 Rev Г?) 2.00 REF
0.675 В± 0.05 3.50 В± 0.05
2.15 В± 0.05 2.38 В±0.05
1.65 В±0.05
PACKAGE
OUTLINE 0.25 В± 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.40 В± 0.10 2.00 REF 3.00 В± 0.10
R = 0.05
TYP 3.00 В± 0.10 6 10 2.38 В±0.10
1.65 В± 0.10 PIN 1
TOP MARK
(SEE NOTE 6)
0.125 REF 0.55 ± 0.05 0.00 – 0.05 5
R = 0.115
TYP 1 (KD10) UTDFN 1106 REV Г? 0.25 В± 0.05
0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE VARIATION OF (TBI).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE …