Корпус Linear Technology 4x3 UTDFN-14 — Даташит

KE Package
14-Lead Plastic UTDFN (4mm Г— 3mm)
(Reference LTC DWG # 05-08-1751 Rev Г?) 0.70 В± 0.05
3.25 В± 0.05 3.60 В± 0.05
2.10 В± 0.05 1.65 В± 0.05
PACKAGE
OUTLINE
0.25 В± 0.05
0.50 BSC
3.00 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 В± 0.10
R = 0.05
TYP R = 0.115
TYP 8 0.40 В± 0.10
14 3.25 В± 0.10
3.00 В± 0.10 1.65 В± 0.10 PIN 1 NOTCH
R = 0.20 OR
0.35 Г— 45В°
CHAMFER PIN 1
TOP MARK
(SEE NOTE 6) (KE14) UTDFN 0407 REV O 7
0.127 REF 1
0.25 В± 0.05 …