Корпус Linear Technology 3x3 UTQFN-20 — Даташит

PD Package
20-Lead Plastic UTQFN (3mm Г— 3mm)
(Reference LTC DWG # 05-08-1835 Rev Г?) 0.70 В±0.05 3.50 В± 0.05 1.60 В± 0.05 2.10 В± 0.05 1.65 В±0.05
1.65 В±0.05
PACKAGE
OUTLINE
0.20 В±0.05
0.40 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 3.00 ± 0.10 BOTTOM VIEW—EXPOSED PAD 0.55 ± 0.05
R = 0.05
TYP PIN 1
TOP MARK
(NOTE 6) PIN 1 NOTCH
0.35 Г— 45В°
CHAMFER R = 0.10
TYP
19 20 0.40 В± 0.10
1
2 3.00 В± 0.10 1.60 REF 1.65 В±0.10
1.65 В±0.10 (PD20) UTQFN 0409 REV Г? 0.150 REF
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE …