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Surface Mount Device LED
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TO-1608BC-BF
Surface Mount Device LED
Chip
Lens Color Part Number
TO-1608BC-BF Material Source Color InGaN Blue Water Clear Features
• IC compatible
• Compatible with automatic placement equipment
• Compatible with infrared and vapor phase reflow soldering process
• Top view type
• Pack in 8 mm tape on 7” diameter reel
• RoHS compliant
• Moisture sensitivity Level: level 3 Dimensions Notes:
1. All dimensions are in millimeter.
2. Tolerance is ±0.1mm unless individual mark noted. REV.: A-1
Notes: Prepared by D.O. Luo (22907) Released Date: 2015/11/16
Above specification may be changed without notice. Doc No :GS15110003 Page 1/3 Absolute Maximum Rating @ Ta=25°C
Parameter Maximum Rating Unit 80 mA Power Dissipation 105 mW Continuous Forward Current 25 mA Reverse Voltage 5 V Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width) Operating Temperature Range -55°C to +85°C Storage Temperature Range -55°C to +105°C IR Reflow Soldering Profile For Lead Free Soldering 260°C Electrical / Optical Characteristic @ Ta=25°C
Parameter
Luminous Intensity
Viewing Angle Symbol Min. Iv 112 Typ. Max. Unit Test Condition 321 mcd IF=20mA 2θ1/2 120 deg IF=20mA Forward Voltage VF 3.2 V IF=20mA Dominant Wavelength λd 468 nm IF=20mA Spectral Line Half-Width △λ 26 nm IF=20mA µA VR=5V Reverse Current REV.: A-1
Notes: IR Prepared by D.O. Luo (22907) Released Date: 2015/11/16
Above specification may be changed without notice. 10 Doc No :GS15110003 Page 2/3 Bin Code List for Reference …
