Datasheet MC34071,2,4,A; MC33071,2,4,A; NCV33072,4,A (ON Semiconductor) - 23

MC34071,2,4,A MC33071,2,4,A, NCV33072,4,A PACKAGE DIMENSIONS TSSOP−14
CASE 948G ISSUE B NOTES:
14X REF K
1. DIMENSIONING AND TOLERANCING PER 0.10 (0.004) M T U S V S ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 0.15 (0.006) T U S 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT
N
EXCEED 0.15 (0.006) PER SIDE. 0.25 (0.010)
14 8
4. DIMENSION B DOES NOT INCLUDE
2X L/2
INTERLEAD FLASH OR PROTRUSION.
M
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
B
5. DIMENSION K DOES NOT INCLUDE
L
DAMBAR PROTRUSION. ALLOWABLE
−U− N PIN 1
DAMBAR PROTRUSION SHALL BE 0.08
IDENT. F
(0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL
1 7
CONDITION.
DETAIL E
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE 0.15 (0.006) T U S
K
DETERMINED AT DATUM PLANE −W−.
A MILLIMETERS INCHES K1 DIM MIN MAX MIN MAX −V− A
4.90 5.10 0.193 0.200
B
4.30 4.50 0.169 0.177
J J1
ÇÇÇ ÉÉÉ
C
−−− 1.20 −−− 0.047
D
0.05 0.15 0.002 0.006 ÇÇÇ ÉÉÉ
F
0.50 0.75 0.020 0.030
SECTION N−N G
0.65 BSC 0.026 BSC
H
0.50 0.60 0.020 0.024
J
0.09 0.20 0.004 0.008
J1
0.09 0.16 0.004 0.006
−W− C K
0.19 0.30 0.007 0.012
K1
0.19 0.25 0.007 0.010
L
6.40 BSC 0.252 BSC 0.10 (0.004)
M
0 8 0 8
−T− SEATING D G H DETAIL E PLANE SOLDERING FOOTPRINT*
7.06 1 0.65 PITCH 14X 14X 0.36 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com 23