Data SheetAD8641/AD8642/AD8643ABSOLUTE MAXIMUM RATINGS Absolute maximum ratings apply at 25°C, unless otherwise noted. THERMAL RESISTANCE θ Table 3. JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. This ParameterRating was measured using a standard 4-layer board. For the LFCSP, Supply Voltage 27.3 V solder the exposed pad to a copper plane, which should be Input Voltage VS− to VS+ connected to V+. Differential Input Voltage ±Supply Voltage Output Short-Circuit Duration Indefinite Table 4. Storage Temperature Range Package TypeθJAθJCUnit KS-5, R-8, RM-8, R-14, CP-16 Packages −65°C to +150°C 5-Lead SC70 (KS) 430 149 °C/W Operating Temperature Range −40°C to +125°C 8-Lead SOIC (R) 121 43 °C/W Junction Temperature Range 8-Lead MSOP (RM) 142 45 °C/W KS-5, R-8, RM-8, R-14, CP-16 Packages −65°C to +150°C 14-Lead SOIC (R) 110 36 °C/W Lead Temperature (Soldering, 60 sec) 300°C 16-Lead LFCSP (CP) 81 16 °C/W Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a ESD CAUTION stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. F | Page 5 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
