Datasheet LTC2360, LTC2361, LTC2362 (Analog Devices) - 19

LTC2360/LTC2361/LTC2362
PACKAGE DESCRIPTION S6 Package 6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636) 2.90 BSC 0.62 0.95 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 0.95 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC (NOTE 3) S6 TSOT-23 0302 REV B NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 2. DRAWING NOT TO SCALE 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 3. DIMENSIONS ARE INCLUSIVE OF PLATING 6. JEDEC PACKAGE REFERENCE IS MO-193
TS8 Package 8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637) 2.90 BSC 0.52 0.65 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.22 – 0.36 0.65 BSC PER IPC CALCULATOR 8 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.95 BSC (NOTE 3) TS8 TSOT-23 0802 NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 2. DRAWING NOT TO SCALE 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 3. DIMENSIONS ARE INCLUSIVE OF PLATING 6. JEDEC PACKAGE REFERENCE IS MO-193 236012fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19