Datasheet LT3011 (Analog Devices) - 15

LT3011
PACKAGE DESCRIPTION DD Package 10-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1699) R = 0.115 0.38 TYP
±
0.10 6 10 0.675
±
0.05 3.50
±
0.05 1.65
±
0.05 3.00
±
0.10 1.65
±
0.10 2.15
±
0.05 (2 SIDES) (4 SIDES) (2 SIDES) PIN 1 PACKAGE TOP MARK OUTLINE (SEE NOTE 6) (DD) DFN 1103 5 1 0.25
±
0.05 0.200 REF 0.75
±
0.05 0.25
±
0.05 0.50 0.50 BSC BSC 2.38
±
0.10 2.38
±
0.05 (2 SIDES) (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE OF VARIATION ASSIGNMENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 2. DRAWING NOT TO SCALE 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE 3. ALL DIMENSIONS ARE IN MILLIMETERS TOP AND BOTTOM OF PACKAGE
MSE Package 12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev B) BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 p 0.102 2.845 p 0.102 (.112 p .004) (.112 p .004) 0.889 p 0.127 (.035 p .005) 1 6 0.35 REF 5.23 1.651 p 0.102 3.20 – 3.45 0.12 REF (.206) (.065 p .004) (.126 – .136) MIN DETAIL “B” CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 12 7
NO MEASUREMENT PURPOSE
0.42 p 0.038 0.65 4.039 p 0.102 (.0165 p .0015) (.0256) (.159 p .004) TYP BSC (NOTE 3) 0.406 p 0.076 RECOMMENDED SOLDER PAD LAYOUT 12 11 10 9 8 7 (.016 p .003) REF DETAIL “A” 0.254 (.010) 3.00 p 0.102 0o – 6o TYP 4.90 p 0.152 (.118 p .004) (.193 p .006) GAUGE PLANE (NOTE 4) 0.53 p 0.152 (.021 p .006) 1 2 3 4 5 6 DETAIL “A” 1.10 0.86 0.18 (.043) (.034) (.007) MAX REF SEATING PLANE 0.22 – 0.38 0.1016 p 0.0508 (.009 – .015) (.004 p .002) TYP 0.650 MSOP (MSE12) 0608 REV B NOTE: (.0256) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 3011f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15