Datasheet LT3071 (Analog Devices) - 28

LT3071
PACKAGE DESCRIPTION UFD Package 28-Lead Plastic QFN (4mm
×
5mm)
(Reference LTC DWG # 05-08-1712 Rev B) 0.70 ±0.05 4.50 ± 0.05 3.10 ± 0.05 2.50 REF 2.65 ± 0.05 3.65 ± 0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 3.50 REF 4.10 ± 0.05 5.50 ± 0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH 2.50 REF R = 0.20 OR 0.35 R = 0.05 × 45° CHAMFER 4.00 ± 0.10 0.75 ± 0.05 R = 0.115 TYP TYP (2 SIDES) 27 28 0.40 ± 0.10 PIN 1 TOP MARK (NOTE 6) 1 2 5.00 ± 0.10 (2 SIDES) 3.50 REF 3.65 ± 0.10 2.65 ± 0.10 (UFD28) QFN 0506 REV B 0.200 REF 0.25 ± 0.05 0.00 – 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X). 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3071fc 28 For more information www.linear.com/LT3071 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Package Description Revision History Typical Application Related Parts