Datasheet LT3483, LT3483A (Analog Devices) - 9

LT3483/LT3483A
TYPICAL APPLICATIONS 3.6V to –8V DC/DC Converter Low Profile, Small Footprint Switching Waveform
C2 L1 0.22µF D1 10µH V VOUT IN 3.6V 20mV/DIV 10Ω SW VOUT V –8V IN D 25mA C1 LT3483 R1 ISW 4.7µF 5pF C3 806k 2.2µF 100mA/DIV SHDN FB GND 3483 TA04b 2µs/DIV C1: MURATA GRM219R61A475KE34B 3483 TA04a C2: TAIYO YUDEN LMK107BJ224 C3: MURATA GRM219R61C225KA88B D1: PHILIPS PMEG2005EB L1: MURATA LQH2MCN100K02L
PACKAGE DESCRIPTION DC Package 8-Lead Plastic DFN (2mm
×
2mm)
(Reference LTC DWG # 05-08-1719 Rev A) R = 0.115 TYP R = 0.05 5 8 0.70 ±0.05 TYP 0.40 ± 0.10 2.55 ±0.05 0.64 ±0.05 2.00 ±0.10 0.64 ± 0.10 1.15 ±0.05 PIN 1 NOTCH (2 SIDES) (4 SIDES) (2 SIDES) PIN 1 BAR R = 0.20 OR PACKAGE TOP MARK 0.25 × 45° OUTLINE (SEE NOTE 6) CHAMFER (DC8) DFN 0409 REVA 4 1 0.23 ± 0.05 0.25 ± 0.05 0.45 BSC 0.200 REF 0.75 ±0.05 0.45 BSC 1.37 1.37 ±0.10 ±0.05 (2 SIDES) (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3483fc 9 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration order information Electrical Characteristics Typical Performance Characteristics pin functions block diagram operation applications information typical applications Package Description Revision History Typical Application Related Parts