LTC3129 e lecTrical characTerisTics The l denotes the specifications which apply over the specified operatingjunction temperature range, otherwise specifications are at TA = 25°C (Note 2). Unless otherwise noted, VIN = 12V, VOUT = 5V. PARAMETERCONDITIONSMINTYPMAXUNITS VOUT UV Hysteresis 150 mV VOUT Current – Shutdown RUN = 0V, VOUT = 15V Including Switch Leakage 10 100 nA VOUT Current – Sleep PWM = 0V, FB = 1.25V 10 nA VOUT Current – Active PWM = VCC, VOUT = 15V (Note 4), FB = 1.25V 5 9 µA PGOOD Threshold, Falling Referenced to Programmed VOUT Voltage –5.5 –7.5 –10 % PGOOD Hysteresis Referenced to Programmed VOUT Voltage 2.5 % PGOOD Voltage Low ISINK = 1mA 250 300 mV PGOOD Leakage PGOOD = 15V 1 50 nA Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 4: Current measurements are made when the output is not switching. may cause permanent damage to the device. Exposure to any Absolute Note 5: This IC includes overtemperature protection that is intended Maximum Rating condition for extended periods may affect device to protect the device during momentary overload conditions. Junction reliability and lifetime. temperature will exceed 125°C when overtemperature protection is active. Note 2: The LTC3129 is tested under pulsed load conditions such that Continuous operation above the specified maximum operating junction TJ ≈ TA. The LTC3129E is guaranteed to meet specifications from temperature may result in device degradation or failure. 0°C to 85°C junction temperature. Specifications over the –40°C to Note 6: Failure to solder the exposed backside of the package to the PC 125°C operating junction temperature range are assured by design, board ground plane will result in a much higher thermal resistance. characterization and correlation with statistical process controls. The Note 7: Switch timing measurements are made in an open-loop test LTC3129I is guaranteed over the full –40°C to 125°C operating junction configuration. Timing in the application may vary somewhat from these temperature range. The junction temperature (TJ) is calculated from the values due to differences in the switch pin voltage during non-overlap ambient temperature (TA) and power dissipation (PD) according to the durations when switch pin voltage is influenced by the magnitude and formula: TJ = TA + (PD • θJA°C/W), where θJA is the package thermal duration of the inductor current. impedance. Note that the maximum ambient temperature consistent with these specifications, is determined by specific operating conditions Note 8: Voltage transients on the switch pin(s) beyond the DC limits in conjunction with board layout, the rated thermal package thermal specified in the Absolute Maximum Ratings are non-disruptive to normal resistance and other environmental factors. operation when using good layout practices as described elsewhere in the data sheet and application notes and as seen on the product demo board. Note 3: Specification is guaranteed by design and not 100% tested in production. Typical perForMance characTerisTics TA = 25°C, unless otherwise noted.Efficiency, VOUT = 2.5VPower Loss, VOUT = 2.5VEfficiency, VOUT = 3.3V 100 1000 100 90 BURST 90 BURST 80 100 80 PWM 70 70 60 10 60 50 50 PWM PWM 40 1 40 EFFICIENCY (%) EFFICIENCY (%) 30 VIN = 2.5V POWER LOSS (mW) V 30 IN = 2.5V VIN = 2.5V V BURST VIN = 3.6V V 20 IN = 3.6V IN = 3.6V V 0.1 20 IN = 5V VIN = 5V VIN = 5V 10 VIN = 10V VIN = 10V 10 VIN = 10V VIN = 15V VIN = 15V VIN = 15V 0 0.01 0 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 1000 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) 3129 G01 3129 G02 3129 G03 3129fc 4 For more information www.linear.com/LTC3129 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
