LTC3423/LTC3424 UTYPICAL APPLICATIOSingle Cell to 1.8V at 300mA, 1.8mm High V V DD = 2.7V TO 5.5V DD L1 IN 4.7µH D1 V V IN = 0.9V TO 1.5V OUT 1.8V 300mA LTC3423 6 4 V R1 DD SW 110k 10 7 SHDN VOUT + 1 3 8 C3 – CELL VIN FB 22µF 2 9 MODE/SYNC VC C4 C1 C2 1 5 470pF 2.2µF 4.7µF R2 Rt GND 249k C5 R f R 4.7pF t C OSC = 1MHz 30.1k 82k C1: TAIYO YUDEN JMK212BJ225MG 0 = FIXED FREQ 3423/24 TA04 C2: TAIYO YUDEN JMK212BJ475MM 1 = Burst Mode OPERATION C3: TAIYO YUDEN JMK325BJ226MM D1: ON SEMICONDUCTOR MBRM120T3 L1: SUMIDA CDRH3D16-4R7M UPACKAGE DESCRIPTIOMS Package10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1661) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) 3.2 – 3.45 MIN (.126 – .136) 3.00 ± 0.102 (.118 ± .004) 3.05 ± 0.38 0.50 0.497 ± 0.076 (NOTE 3) (.0120 ± .0015) (.0197) (.0196 ± .003) 10 9 8 7 6 TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 4.88 ± 0.10 DETAIL “A” (.118 ± .004) (.192 ± .004) 0.254 NOTE 4 (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 5 0.53 ± 0.01 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.13 ± 0.05 (.007 – .011) (.005 ± .002) 0.50 MSOP (MS) 1001 (.0197) NOTE: TYP 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 34234f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 11
