Datasheet LTC3525L-3 (Analog Devices) - 10

LTC3525L-3
PACKAGE DESCRIPTION SC6 Package 6-Lead Plastic SC70
(Reference LTC DWG # 05-08-1638 Rev B) 0.47 0.65 1.80 – 2.20 MAX REF (NOTE 4) 1.00 REF INDEX AREA 1.15 – 1.35 (NOTE 6) 1.80 – 2.40 2.8 BSC 1.8 REF (NOTE 4) PIN 1 RECOMMENDED SOLDER PAD LAYOUT 0.15 – 0.30 0.65 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.10 – 0.40 0.80 – 1.00 0.00 – 0.10 REF 1.00 MAX GAUGE PLANE 0.15 BSC 0.26 – 0.46 SC6 SC70 1205 REV B 0.10 – 0.18 (NOTE 3) NOTE: 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 1. DIMENSIONS ARE IN MILLIMETERS 6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL, 2. DRAWING NOT TO SCALE BUT MUST BE LOCATED WITHIN THE INDEX AREA 3. DIMENSIONS ARE INCLUSIVE OF PLATING 7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 8. JEDEC PACKAGE REFERENCE IS MO-203 VARIATION AB 3525lfa 10 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Package Description Revision History Typical Applications Related Parts