Datasheet LTM8045 (Analog Devices) - 2

LTM8045
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V TOP VIEW IN, RUN ...20V RT, SYNC ..5V V – 5 V SS, FB ..2.5V OUT IN BANK 1 BANK 4 4 V + – OUT (VOUT = 0V) ...16V GND 3 FB V – + OUT (VOUT = 0V) ... –16V BANK 3 RUN 2 Maximum Internal Temperature .. 125°C V + OUT SYNC BANK 2 Maximum Solder Temperature .. 250°C 1 Storage Temperature.. –55°C to 125°C A B C D E F G H SS RT BGA PACKAGE 40-LEAD (11.25mm × 6.25mm × 4.92mm) TJMAX = 125°C, θJA = 28.7°C/W, θJB = 7.6°C/W, θJCtop = 40.3°C/W, θJCbottom = 10.5°C/W θ VALUES DETERMINED PER JEDEC 51-9, 51-12 WEIGHT = 0.9g
orDer inForMaTion http://www.linear.com/product/LTM8045#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM8045EY#PBF SAC305 (RoHS) LTM8045Y e1 BGA 3 –40°C to 125°C LTM8045IY#PBF SAC305 (RoHS) LTM8045Y e1 BGA 3 –40°C to 125°C LTM8045IY SnPb (63/37) LTM8045Y e0 BGA 3 –40°C to 125°C LTM8045MPY#PBF SAC305 (RoHS) LTM8045Y e1 BGA 3 –55°C to 125°C LTM8045MPY SnPb (63/37) LTM8045Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8045fc 2 For more information www.linear.com/LTM8045 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Photo Package Description Revision History Typical Application Related Parts