AD7450ABSOLUTE MAXIMUM RATINGS1 Lead Temperature, Soldering (TA = 25°C, unless otherwise noted.) Vapor Phase (60 secs) . 215oC V Infrared (15 secs) . 220oC DD to GND . –0.3 V to +7 V V ESD . 3.5 kV IN+ to GND . –0.3 V to VDD + 0.3 V VIN– to GND . –0.3 V to VDD + 0.3 V NOTES Digital Input Voltage to GND . –0.3 V to V 1Stresses above those listed under the Absolute Maximum Ratings may cause DD + 0.3 V Digital Output Voltage to GND . –0.3 V to V permanent damage to the device. This is a stress rating only and functional DD + 0.3 V operation of the device at these or any conditions above those listed in the VREF to GND . –0.3 V to VDD + 0.3 V operational sections of this specification is not implied. Exposure to absolute Input Current to Any Pin Except Supplies2 . ± 10 mA maximum rating conditions for extended periods may affect device reliability. Operating Temperature Range 2Transient currents of up to 100 mA will not cause SCR latch up. Commercial (A and B Version) . –40oC to +85oC Storage Temperature Range . –65oC to +150oC 200AIOL Junction Temperature . 150oC SOIC, µSOIC Package, Power Dissipation . 450 mW JA Thermal Impedance . 157°C/W (SOIC) TO . 205.9°C/W (µSOIC) OUTPUT1.6VPIN CL JC Thermal Impedance . 56°C/W (SOIC) 50pF . 43.74°C/W (µSOIC) 200AIOH Figure 2. Load Circuit for Digital Output Timing Specifications CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the WARNING! AD7450 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to ESD SENSITIVE DEVICE avoid performance degradation or loss of functionality. Rev. A –5–
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