Datasheet AD7721 (Analog Devices) - 6

AD7721 ABSOLUTE MAXIMUM RATINGS1
Lead Temperature, Soldering (10 sec) . +260°C (TA = +25°C unless otherwise stated) Cerdip Package DVDD to DGND . –0.3 V to +7 V θJA Thermal Impedance . 51°C/W AVDD to AGND . –0.3 V to +7 V Lead Temperature, Soldering (10 sec) . +300°C AVDD to DVDD . –0.3 V to +0.3 V SOIC Package AGND to DGND . –0.3 V to +0.3 V θJA Thermal Impedance . 72°C/W Digital Input Voltage to DGND . –0.3 V to DVDD + 0.3 V Lead Temperature, Soldering Analog Input Voltage to AGND . –0.3 V to AVDD + 0.3 V Vapor Phase (60 sec) . +215°C Input Current to Any Pin Except Supplies2 . ± 10 mA Infrared (15 sec) . +220°C Operating Temperature Range NOTES Industrial (A Version) . –40°C to +85°C 1Stresses above those listed under Absolute Maximum Ratings may cause perma- Extended (S Version) . –55°C to +125°C nent damage to the device. This is a stress rating only; functional operation of the Storage Temperature Range . –65°C to +150°C device at these or any other conditions above those listed in the operational Maximum Junction Temperature . +150°C sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Plastic Package 2Transient currents of up to 100 mA will not cause SCR latchup. θJA Thermal Impedance . 74°C/W
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection.
WARNING!
Although this device features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE PIN CONFIGURATION Model Temperature Range Package Option* SCLK/DB7 1 28 DB6
AD7721AN –40°C to +85°C N-28
DB8 2 27
AD7721AR –40°C to +85°C R-28
RD DB9 3 26
AD7721SQ –55°C to +125°C Q-28
WR 4 25 DVAL/ RFS/DB10 SYNC
*N = Plastic DIP; R = 0.3" Small Outline IC (SOIC); Q = Cerdip.
SDATA/DB11 5 24 AGND AD7721 DGND 6 TOP VIEW 23 VIN2 DSUBST 7 (Not to Scale) 22 VIN1 DGND 8 21 REFIN STBY/DB0 9 20 AGND DV 10 19 DD AVDD CAL/DB1 11 18 CS 12 17 UNI/DB2 CLK DB3 13 16 DRDY DB4 14 15 SYNC/DB5
REV. A –5–