Datasheet AD558 (Analog Devices) - 4

AD558 ABSOLUTE MAXIMUM RATINGS* (LSB) DB0 1 16 VOUT
VCC to Ground . 0 V to +18 V
DB1 2 15 VOUT SENSE
Digital Inputs (Pins 1–10) . 0 V to +7.0 V
DB2 3 14 VOUT SELECT
VOUT . Indefinite Short to Ground
DB3 4 AD558 13 GND
Momentary Short to VCC
TOP VIEW DB4 5 12 GND
Power Dissipation . 450 mW
(Not to Scale) DB5 6 11 +V
Storage Temperature Range
CC DB6 7 10 CS
N/P (Plastic) Packages . –25°C to +100°C
(MSB) DB7 8 9 CE
D (Ceramic) Package . –55°C to +150°C Lead Temperature (soldering, 10 sec) . +300°C Figure 1a. AD558 Pin Configuration (DIP) Thermal Resistance Junction to Ambient/Junction to Case D (Ceramic) Package . 100°C/W/30°C/W
SENSE
N/P (Plastic) Packages . 140°C/W/55°C/W
OUT OUT
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
DB1 DB0 (LSB) NC V V
permanent damage to the device. This is a stress rating only and functional
3 2 1 20 19
operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute
DB2 4 18 VOUTSELECT
maximum rating conditions for extended periods may affect device reliability.
DB3 5 AD558 17 GND NC 6 TOP VIEW 16 NC AD558 METALIZATION PHOTOGRAPH (Not to Scale) DB4 7 15 GND +V
Dimensions shown in inches and (mm).
DB5 8 14 CC 9 10 11 12 13 NC CE CS DB6 NC = NO CONNECT (MSB) DB7
Figure 1b. AD558 Pin Configuration (PLCC and LCC)
Bond Pad Coordinates Pad No. Pad Name X Coordinate Y Coordinate
1 DB0 −702 1265 2 DB1 −927 1265 3 DB2 −957 1004 4 DB3 −957 347 5 DB4 −957 115 6 DB5 −957 −111 7 DB6 −927 −1248 8 DB7 −702 −1248 9 CE 47 −1248 10 CS 272 −1248 11 VCC 957 −1225 12 2 GND 957 −965 13 3 GND 946 970 14 VOUTSELECT 923 1265 15 VOUTSENSE 689 1265 16 VOUT −461 1265 REV. B –3–