Datasheet AD558 (Analog Devices) - 10

Data Sheet AD558 ORDERING GUIDE Relative Accuracy Error Max Full Scale Error Max Model Temperature Range TMIN to TMAX TMIN to TMAX Package Option
AD558JN 0°C to +70°C ±1/2 LSB ±2.5 LSB PDIP (N-16) AD558JNZ 0°C to +70°C ±1/2 LSB ±2.5 LSB PDIP (N-16) AD558JP 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JP-REEL7 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ-REEL 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JPZ-REEL7 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20) AD558JD 0°C to +70°C ±1/2 LSB ±2.5 LSB SBDIP (D-16) AD558KN 0°C to +70°C ±1/4 LSB ±1 LSB PDIP (N-16) AD558KNZ 0°C to +70°C ±1/4 LSB ±1 LSB PDIP (N-16) AD558KP 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KPZ 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KPZ-REEL7 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20) AD558KD 0°C to +70°C ±1/4 LSB ±1 LSB SBDIP (D-16) AD558SD –55°C to +125°C ±3/4 LSB ±2.5 LSB SBDIP (D-16) AD558TD –55°C to +125°C ±3/8 LSB ±1 LSB SBDIP (D-16) AD558TCHIPS –55°C to +125°C ±3/8 LSB ±1 LSB Die part AD558SD/883B –55°C to +125°C ±3/4 LSB ±2.5 LSB SBDIP (D-16) AD558SE/883B –55°C to +125°C ±3/4 LSB ±2.5 LSB LCC (E-20-1) AD558TD/883B –55°C to +125°C ±3/8 LSB ±1 LSB SBDIP (D-16) AD558TE/883B –55°C to +125°C ±3/8 LSB ±1 LSB LCC (E-20-1) 1 For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices Military Products Databook or current AD558/883B data sheet. 2S = Ceramic SBDIP; N = Plastic PDIP; P = Plastic Leaded Chip Carrier.
REVISION HISTORY 6/2017—Rev. A to Rev. B
Added Bond Pad Coordinates Table ... 3 Updated Outline Dimensions .. 8 Changes to Ordering Guide ... 9
©1987–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09374-0-6/17(B)
–9–