1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) ... 18 V dc Internal power dissipation (PD) .. 280 mW Input voltage .. VS maximum Storage temperature range (TSTG) ... -65C to +150C Lead temperature (soldering, 10 seconds) .. +300C Thermal resistance Thermal resistance, junction-to-case (JC) .. See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) : Case outline E ... 95C/W Case outline 2 .. 150C/W 1.4 Recommended operating conditions. Supply voltage (VS) ... ±6 V dc to ±18 V dc Ambient operating temperature range (TA) ... -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ... 100 Krads(Si) 2/ ________ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. STANDARD SIZE 5962-88539MICROCIRCUIT DRAWINGA DLA LAND AND MARITIME REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 G 3 DSCC FORM 2234 APR 97
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