Datasheet AD8634-KGD (Analog Devices) - 6

AD8634-KGD Known Good Die PAD CONFIGURATION AND FUNCTION DESCRIPTIONS V+ 8 1 7 2 6 – + + – 3 5 4 V–
002 1524- 1 Figure 2. Pad Configuration and Functional Block Diagram
Table 4. Pad Function Descriptions1 Pad No. X-Axis (µm ) Y-Axis (µm ) Mnemonic Description
1 −566 330 OUT A Output Pad of Amplifier A. 2 −566 227 −IN A Inverting Input Pad of Amplifier A. 3 −566 −97 +IN A Non-Inverting Input Pad of Amplifier A. 4 −566 −377 V− Pad Negative Power Supply Pad. Substrate is connected to V−. 5 566 −98 +IN B Non-Inverting Input Pad of Amplifier B. 6 566 227 −IN B Inverting Input Pad of Amplifier B. 7 566 330 OUT B Output Pad of Amplifier B. 8 544 456 V+ Positive Power Supply Pad. 1 Die center is the reference location at 0.0 µm × 0.0 µm. Pad coordinates are to the center of each pad. Rev. 0 | Page 6 of 7 Document Outline Features Applications Metal Mask Die Image General Description Table of Contents Revision History Specifications Electrical Characteristics, VSY = ±15.0 V Electrical Characteristics, VSY = 5.0 V Absolute Maximum Ratings ESD Caution Pad Configuration And Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide