Datasheet AD8634-KGD (Analog Devices) - 7

Known Good Die AD8634-KGD OUTLINE DIMENSIONS 0.493 1.33 0.483 0.473 8 1 7 2 6 1.10 3 5 4 A TOP VIEW SIDE VIEW (CIRCUIT SIDE) 2014- 0.07 × 0.07 27- 06-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit1
Chip Size 1240 × 1020 µm Scribe Line Width 90 × 90 µm Die Size 1330 × 1100 µm Thickness 483 µm Bond Pad 70 × 70 µm Bond Pad Composition 1.0 AlSi, 0.5AlCu % Backside V- biased N/A Passivation Oxynitride N/A 1 N/A means not applicable.
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy Adhesive Bonding Method Gold Ball or Aluminum Wedge Bonding Sequence Bond Pin 1 First
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8634-KGD-CHIP −40°C to +210°C 8-Pad Bare Die [CHIP] C-8-3
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Rev. 0 | Page 7 of 7 Document Outline Features Applications Metal Mask Die Image General Description Table of Contents Revision History Specifications Electrical Characteristics, VSY = ±15.0 V Electrical Characteristics, VSY = 5.0 V Absolute Maximum Ratings ESD Caution Pad Configuration And Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide