Datasheet DN2540 (Microchip) - 7

DN2540 3-Lead TO-220 Package Outline (N5)
A Seating E Plane A E2 E A1 ΦP Q H1 H1 4 D1 D Chamfer Thermal D1 Optional Pad 1 2 3 E1 L View B A2 e c A
Front View Side View View A - A
1 2 3 L1 b2 b
View B Symbol A A1 A2 b b2 c D D1 D2 E E1 E2 e H1 L L1 Q Φ P
MIN .140 .020 .080 .015 .045 .012† .560 .326† .474† .380 .270 0.20* .230 .500 .200* .100 .139
Dimen- sion
.100 NOM - - - .027 .057 - - - - - - - - - - - -
(inches)
BSC MAX .190 .055 .120† .040 .070 .024 .650 .361† .507 .420 .350 .030 .270 .580 .250 .135 .161 JEDEC Registration TO-220, Variation AB, Issue K, April 2002. * This dimension is not specified in the JEDEC drawing. † This dimension differs from the JEDEC drawing.
Drawings not to scale. Supertex Doc. #:
DSPD-3TO220N5, Version C041009. Doc.# DSFP-DN2540
Supertex inc.
B060313 7
www.supertex.com