Datasheet LND150 (Microchip) - 5

LND150 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
D 3 E1 E Gauge 0.25 Plane Seating L 1 2 Plane L1 e b e1
Top View View B
View B A A A2 Seating Plane A1
Side View
A
View A - A Symbol A A1 A2 b D E E1 e e1 L L1 θ
MIN 0.89 0.01 0.88 0.30 2.80 2.10 1.20 0.20† 0O Dimension 0.95 1.90 0.54 (mm) NOM - - 0.95 - 2.90 - 1.30 BSC BSC 0.50 REF - MAX 1.12 0.10 1.02 0.50 3.04 2.64 1.40 0.60 8O JEDEC Registration TO-236, Variation AB, Issue H, Jan. 1999. † This dimension differs from the JEDEC drawing.
Drawings not to scale. Supertex Doc.#:
DSPD-3TO236ABK1, Version C041309. Doc.# DSFP-LND150
Supertex inc.
C041114 5
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