Datasheet LND250 (Microchip) - 3

LND250 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
D 3 E1 E Gauge 0.25 Plane Seating L 1 2 Plane L1 e b e1
Top View View B
View B A A A2 Seating Plane A1
Side View
A
View A - A Symbol A A1 A2 b D E E1 e e1 L L1 θ
MIN 0.89 0.01 0.88 0.30 2.80 2.10 1.20 0.20† 0O Dimension 0.95 1.90 0.54 (mm) NOM - - 0.95 - 2.90 - 1.30 BSC BSC 0.50 REF - MAX 1.12 0.10 1.02 0.50 3.04 2.64 1.40 0.60 8O JEDEC Registration TO-236, Variation AB, Issue H, Jan. 1999. † This dimension differs from the JEDEC drawing.
Drawings not to scale. Supertex Doc.#:
DSPD-3TO236ABK1, Version C041309. (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to http://www.supertex.com/packaging.html.)
Supertex inc.
does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives an adequate “product liability indemnification insurance agreement.”
Supertex inc.
does not assume responsibility for use of devices described, and limits its liability to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and specifications are subject to change without notice. For the latest product specifications refer to the
Supertex inc.
(website: http//www.supertex.com) ©2014
Supertex inc.
All rights reserved. Unauthorized use or reproduction is prohibited.
Supertex inc.
1235 Bordeaux Drive, Sunnyvale, CA 94089 Tel: 408-222-8888 Doc.# DSFP-LND250 B012314 3
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