LTC4301L UPACKAGE DESCRIPTIODD Package8-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1698) 0.675 ±0.05 3.5 ±0.05 1.65 ±0.05 2.15 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 2.38 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS R = 0.115 0.38 ± 0.10 TYP 5 8 3.00 ±0.10 1.65 ± 0.10 (4 SIDES) (2 SIDES) PIN 1 TOP MARK (NOTE 6) (DD) DFN 1203 4 1 0.200 REF 0.75 ±0.05 0.25 ± 0.05 0.50 BSC 2.38 ±0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE 4301lfa 10
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