LTC5509 UPACKAGE DESCRIPTIOSC6 Package6-Lead Plastic SC70 (Reference LTC DWG # 05-08-1638) 0.47 0.65 1.80 – 2.20 MAX REF (NOTE 4) 1.16 REF INDEX AREA (NOTE 6) 1.15 – 1.35 1.80 – 2.40 3.26 MAX 2.1 REF 0.96 MIN (NOTE 4) PIN 1 RECOMMENDED SOLDER PAD LAYOUT 0.15 – 0.30 0.65 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.10 – 0.40 0.80 – 1.00 0.00 – 0.10 REF 1.00 MAX 0.10 – 0.30 0.10 – 0.18 SC6 SC70 0802 (NOTE 3) NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE INDEX AREA 7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70 5509f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7
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