MIC4607 DC CHARACTERISTICS (Note 1, 2) (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VDD = VxHB = 12V; VEN = 5V; VSS = VHS = 0V; No load on xLO or xHO; TA = 25°C; unless noted. Bold values indicate –40°C< TJ < +125°C. Parameters Sym. Min. Typ. Max. Units Conditions Switch Node Voltage Threshold Signaling HO is Off VSWTH 1 2.2 4 V — Delay between HO FET Being Considered Off to LO Turning On tLOON — 35 75 ns — Forced xLO On if VSWTH is tSWTO 100 250 500 ns — Not Detected Note 1: “x” in front of a pin name refers to either A, B or C phase. (e.g. xHI can be either AHI, BHI or CHI). 2: Specification for packaged product only. 3: VIL(MAX) = maximum positive voltage applied to the input which will be accepted by the device as a logic low. VIH(MIN) = minimum positive voltage applied to the input which will be accepted by the device as a logic high. 4: Guaranteed by design. Not production tested. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, TA = +25°C, VIN = VEN = 12V, VBOOST – VSW = 3.3V, VOUT = 3.3V Parameters Sym. Min. Typ. Max. Units Conditions Operating Junction Temperature Range TJ –40 — +125 °C Operating Ambient Temperature Range TA –40 — +125 °C — Lead Temperature — — 260 — °C Soldering, 10s Storage Temperature Range TS –60 — +150 °C — Maximum Junction Temperature TJ — — +125 °C — Thermal Resistance, 4 mm × 5 mm QFN-28L JA — 43 — °C/W — Thermal Resistance, 4 mm × 5 mm QFN-28L JC — 3.4 — °C/W — TSSOP-28L JA — 70 — °C/W — TSSOP-28L JC — 20 — °C/W — Temperature Ranges — Package Thermal Resistances 2016 Microchip Technology Inc. DS20005610A-page 7
