Datasheet ADA4841-2KGD (Analog Devices) - 8

ADA4841-2KGD Known Good Die OUTLINE DIMENSIONS 1.525 0.305 1A 1B 8A 8B 7 2 0.940 3 6 A 4A 4B 5 2015- TOP VIEW SIDE VIEW 0.070 × 0.140 (CIRCUIT SIDE) 17- 0.070 × 0.070 09-
Figure 4. 8-Pad Bare Die [CHIP] (C-8-4) Dimensions shown in millimeters
1.525 0.254 1A 1B 8A 8B 7 2 0.940 3 6 A 4A 4B 5 2017- TOP VIEW SIDE VIEW 0.070 × 0.140 (CIRCUIT SIDE) 21- 0.070 × 0.070 04-
Figure 5. 8-Pad Bare Die [CHIP] (C-8-10) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Scribe Line Width 75 μm Die Size (Maximum Size) 1525 × 940 μm Thickness ADA4841-2KGD-WP 305 μm ADA4841-2KGD-PT 254 μm Bond Pads (Minimum Size) 70 × 70 μm Bond Pad Composition 0.5% AlCu % Backside Silicon on insulator (SOI) Not applicable Passivation Doped-oxide/SiN Not applicable ESD, Human Body Model (HBM) 2000 V Rev. A | Page 8 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY 5 V SUPPLY 3 V SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE