1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square lead less chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) ... ±20 V Input voltage (VIN) ... ±20 V 2/ Differential input voltage .. ±40 V 2/ Output short-circuit duration .. Indefinite Storage temperature range ... -65°C to +150°C Lead temperature (soldering, 60 seconds) ... +300°C Power dissipation (PD) ... 500 mW 3/ Thermal resistance, junction-to-case (θJC) .. See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Case G ... 150°C/W Cases H and P ... 119°C/W Case 2 .. 120°C/W 1.4 Recommended operating conditions. Supply voltage (VS) .. ±15 V Source resistance (RS) .. 50 Ω Common mode voltage (VCM) ... 0 V Input voltage range (VINR) ... ±11 V Ambient operating temperature range (TA) .. -55°C to +125°C _____ 1/ Unless otherwise specified, TA = +25°C. 2/ For supply voltages less than 20 V, the absolute maximum input voltage is equal to the supply voltage. 3/ Must withstand the added PD due to short circuit test, e.g., ISC. STANDARD SIZE 5962-88513MICROCIRCUIT DRAWINGA DLA LAND AND MARITIME REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 G 3 DSCC FORM 2234 APR 97 Document Outline DEPARTMENT OF DEFENSE SPECIFICATION DEPARTMENT OF DEFENSE STANDARDS
