Datasheet MAX756, MAX757 (Maxim) - 8

MAX756/MAX757
3.3V/5V/Adjustable-Output 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters PC Layout and Grounding ___________________Chip Topography
The MAX756/MAX757 high peak currents and high-fre-
SHDN LX
quency operation make PC layout important for mini- mizing ground bounce and noise. The distance between the MAX756/MAX757’s GND pin and the ground leads of C1 and C2 in Figure 1 must be kept to
3/5 (MAX756)
less than 0.2" (5mm). All connections to the FB and LX
FB (MAX757)
pins should also be kept as short as possible. To obtain maximum output power and efficiency and mini- mum output ripple voltage, use a ground plane and
GND
solder the MAX756/MAX757 GND (pin 7) directly to the
0.122"
ground plane.
(3.10mm) GND REF OUT LBI LBO 0.080" (2.03mm)
TRANSISTOR COUNT: 758 SUBSTRATE CONNECTED TO OUT
________________________________________________________Package Information INCHES MILLIMETERS DIM MIN MAX MIN MAX
A 0.053 0.069 1.35 1.75 A1 0.004 0.010 0.10 0.25 B 0.014 0.019 0.35 0.49 C 0.007 0.010 0.19 0.25 D 0.189 0.197 4.80 5.00
E H
E 0.150 0.157 3.80 4.00 e 0.050 BSC 1.27 BSC H 0.228 0.244 5.80 6.20 h 0.010 0.020 0.25 0.50 L 0.016 0.050 0.40 1.27 α 0° 8° 0° 8° 21-325A
D h x 45˚
α
A
0.127mm
8-PIN PLASTIC
0.004in.
e SMALL-OUTLINE A1 C L PACKAGE B
8 Maxim Integrated