Data SheetAD8340PIN CONFIGURATION AND FUNCTION DESCRIPTIONSFFRFRFIPFIMVPRCMRFRCMVPR242322212019QFLP 118 IFLPQFLM 217 IFLMAD8340QBBP 316 IBBPTOP VIEWQBBM 415 IBBM(Not to Scale)VPS2 514 VPS2VPS2 613 DSOP789110112PPPPP 002 OOOOOFOMCMCMRFRCMCM 04699- NOTES 1. THE EXPOSED PAD MUST BE CONNECTED TO GROUND VIA A LOW IMPEDANCE PATH. Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No.MnemonicDescription 1; 2 QFLP; QFLM Q Baseband Input Filter Pins. Connect optional capacitor to reduce Q baseband channel low-pass corner frequency. 3; 4 QBBP; QBBM Q Channel Differential Baseband Inputs. 5, 6, 14; 19, 24 VPS2; VPRF Positive Supply Voltage, 4.75 V to 5.25 V. 7, 8, 11, 12; 20, 23 CMOP; CMRF Device Common. Connect via lowest possible impedance to external circuit common. 9; 10 RFOP; RFOM Differential RF Outputs. Must be ac-coupled. Differential impedance 50 Ω nominal. 13 DSOP Output Disable. Pull high to disable output stage. 15; 16 IBBM; IBBP I Channel Differential Baseband Inputs. 17; 18 IFLM; IFLP I Baseband Input Filter Pins. Connect optional capacitor to reduce I baseband channel low-pass corner frequency. 21; 22 RFIM; RFIP Differential RF Inputs. Must be ac-coupled. Differential impedance 50 Ω nominal. EPAD Exposed Pad. The exposed pad must be connected to ground via a low impedance path. Rev. C | Page 5 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation RF Quadrature Generator I-Q Attenuators and Baseband Amplifiers Output Amplifier Noise and Distortion Gain and Phase Accuracy RF Frequency Range Applications Information Using the AD8340 RF Input and Matching RF Output and Matching Driving the I-Q Baseband Controls Interfacing to High Speed DACs CDMA2000 Application Evaluation Board Schematic and Artwork Outline Dimensions Ordering Guide
