Datasheet ADR225-KGD-CHIPS (Analog Devices) - 5

Known Good Die ADR225-KGD-CHIPS PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NC V NC OUT 1 8 7b FORCE VS 2a VOUT 7a V SENSE S 2b 6 NC GND 3 4 5
002
NC NC
14153- Figure 2. Pad Configuration
Table 3. Pad Function Descriptions1 Pad No. X-Axis (μm) Y-Axis (μm) Mnemonic Description
1 −368 +587 NC No Connect. Do not connect to this pad. 2a −362 +423 V Input. The input must be connected to both V pads. S S 2b −360 +18 V Input. The input must be connected to both V pads. S S 3 −362 −401 GND Ground. 4 −149 −525 NC No Connect. Do not connect to this pad. 5 +345 −577 NC No Connect. Do not connect to this pad. 6 +368 −256 NC No Connect. Do not connect to this pad. 7a +330 +36 V SENSE Sense Output. The output must be connected to both V SENSE and V FORCE OUT OUT OUT pads. 7b +339 +576 V FORCE Force Output. The output must be connected to both V SENSE and V FORCE OUT OUT OUT pads. 8 −122 +576 NC No Connect. Do not connect to this pad. 1 The die center is the reference location at 0.0 µm × 0.0 μm. The pad coordinates are to the center of each pad. Rev. 0 | Page 5 of 6 Document Outline FEATURES APPLICATIONS METAL MASK DIE IMAGE GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS ORDERING GUIDE