Datasheet ADR225-KGD-CHIPS (Analog Devices) - 6

ADR225-KGD-CHIPS Known Good Die OUTLINE DIMENSIONS 0.995 0.483 1 8 7b 2a 7a 1.425 2b 6 3 4 5 TOP VIEW SIDE VIEW A (CIRCUIT SIDE) 0.092 × 0.086 2016- 0.092 × 0.172 12- 02-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-7) Dimensions shown in millimeters
Table 4. Die Specifications Parameter Value Unit
Chip Size 920 × 1350 μm Scribe Line Width 75 × 75 μm Die Size 995 × 1425 μm Thickness 483 μm Bond Pad 92 × 86 μm Bond Pad Composition AlCu (0.5) % Passivation Oxynitride Not applicable Polyimide None Not applicable Die Marker 225 Not applicable Backside GND Not applicable
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence GND pad first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADR225-KGD-CHIP −40°C to +210°C 8-Pad Bare Die [CHIP] C-8-7
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Rev. 0 | Page 6 of 6 Document Outline FEATURES APPLICATIONS METAL MASK DIE IMAGE GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS ORDERING GUIDE