Datasheet LTM8053, LTM8053-1 (Analog Devices) - 2

LTM8053/LTM8053-1
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
TOP VIEW VIN, RUN, PG Voltage ..42V AUX, V RUN BANK 2 OUT, BIAS Voltage ..19V GND VIN FB, TR/SS Voltage...4V 6 SYNC Voltage ..6V RT TR/SS 5 Maximum Internal Temperature .. 125°C SHARE SYNC BANK 1 BANK 3 Storage Temperature.. –50°C to 125°C 4 PG GND VOUT Peak Reflow Solder Body Temperature ... 250°C 3 AUX BIAS 2 GND FB 1 A B C D E F G H 48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE TJMAX = 125°C, θJA = 24.3°C/W, θJCbottom = 5.8°C/W, θJCtop = 16.8°C/W, θJB = 5.9°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8053EY#PBF SAC305 (RoHS) LTM8053 e1 BGA 3 –40°C to 125°C LTM8053IY#PBF LTM8053EY-1#PBF SAC305 (RoHS) LTM8053-1 e1 BGA 3 –40°C to 125°C LTM8053IY-1#PBF • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings Rev D 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Typical Applications Package Description Package Photos Package Description Revision History Typical Application Related Parts