Datasheet LTM4628 (Analog Devices) - 2

LTM4628
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN ... –0.3V to 28V DIFFP, DIFFN ... –0.3V to INTVCC VSW1, VSW2 ..–1V to 28V VFB1, VFB2, COMP1, COMP2 (Note 6) .. –0.3V to 2.7V PGOOD1, PGOOD2, RUN1, RUN2, INTVCC Peak Output Current ..100mA INTVCC, EXTVCC... –0.3V to 6V Internal Operating Temperature Range MODE_PLLIN, fSET, TRACK1, TRACK2, (Note 2) .. –40°C to 125°C DIFFOUT, PHASMD ... –0.3V to INTVCC Storage Temperature Range .. –55°C to 125°C VOUT1, VOUT2, VOUTS1, VOUTS2 ... –0.3V to 6V Peak Package Body Temperature .. 245°C
PIN CONFIGURATION
TOP VIEW TOP VIEW M M VIN VIN L L K K TEMP EXTVCC TEMP EXTVCC J J INTVCC INTVCC H H SW1 PHASMD CLKOUT SW2 PGOOD2 PGOOD1 SW1 PHASMD CLKOUT PGOOD2 PGOOD1 SW2 G G MODE_PLLIN RUN1 SGND DIFFOUT RUN2 MODE_PLLIN RUN1 SGND DIFFOUT RUN2 F F GND TRACK1 COMP1 COMP2 GND DIFFP DIFFN GND TRACK1 COMP1 COMP2 GND DIFFP DIFFN E E VFB1 V SGND FB2 TRACK2 VFB1 V SGND FB2 TRACK2 D D VOUTS1 fSET SGND VOUTS2 VOUTS1 fSET SGND VOUTS2 C C B B VOUT1 GND VOUT2 VOUT1 GND VOUT2 A A 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 LGA PACKAGE BGA PACKAGE 144-LEAD (15mm × 15mm × 4.32mm) 144-LEAD (15mm × 15mm × 4.92mm) TJMAX = 125°C, θJCtop = 17°C/W,θJCbottom = 2.75°C/W, TJMAX = 125°C, θJCtop = 17°C/W,θJCbottom = 2.75°C/W, θJB + θBA = 11°C/W, θJA = 9.5°C/W–11°C/W, θJB + θBA = 11°C/W, θJA = 9.5°C/W–11°C/W, θBA = BOARD TO AMBIENT RESISTANCE, θ VALUES DEFINED PER JESD 51-12 θBA = BOARD TO AMBIENT RESISTANCE, θ VALUES DEFINED PER JESD 51-12 WEIGHT = 2.7g WEIGHT = 2.9g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM4628EV#PBF Au (RoHS) LTM4628V e4 LGA 3 –40°C to 125°C LTM4628IV#PBF Au (RoHS) LTM4628V e4 LGA 3 –40°C to 125°C LTM4628EY#PBF SAC305 (RoHS) LTM4628Y e1 BGA 3 –40°C to 125°C LTM4628IY#PBF SAC305 (RoHS) LTM4628Y e1 BGA 3 –40°C to 125°C LTM4628IY SnPb (63/37) LTM4628Y e0 BGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4628fe 2 For more information www.linear.com/LTM4628 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photos Revision History Typical Application Related Parts