Datasheet LTM8031 (Analog Devices) - 2

LTM8031
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
VIN, FIN, RUN/SS Voltage ..40V TOP VIEW ADJ, RT, SHARE Voltage ...5V 1 2 3 4 5 6 7 VOUT GND VOUT, AUX ...10V A Current from AUX ..100mA B PGOOD, SYNC ..30V BANK 1 C BIAS ..25V D VIN + BIAS ...56V E Maximum Junction Temperature (Note 2)... 125°C F Solder Temperature (Note 3) ... 245°C BANK 2 G RT H SHARE J BIAS ADJ AUX K PGOOD BANK 3 L VIN FIN RUN/SS SYNC LGA PACKAGE 71-LEAD (9mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 20.7°C/W, θJC(BOTTOM) = 8.4°C/W, θJC(TOP) = 25.6°C/W, θJBOARD = 13.8°C/W θ VALUES DETERMINED PER JESD 51-9 WEIGHT = 1.2g
orDer inForMaTion LEAD FREE FINISH TRAY PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTM8031EV#PBF LTM8031EV#PBF LTM8031V 71-Lead (9mm × 15mm × 2.82mm) LGA –40°C to 125°C LTM8031IV#PBF LTM8031IV#PBF LTM8031V 71-Lead (9mm × 15mm × 2.82mm) LGA –40°C to 125°C LTM8031MPV#PBF LTM8031MPV#PBF LTM8031V 71-Lead (9mm × 15mm × 2.82mm) LGA –55°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ This product is only offered in trays. For more information go to: http://www.linear.com/packaging/ 8031fb 2 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical application Related Parts