LTM4600 absoluTe MaxiMuM raTingspin conFiguraTion(Note 1) FCB, EXTV TOP VIEW CC, PGOOD, RUN/SS, VOUT ... –0.3V to 6V V V CC IN, SVIN, fADJ .. –0.3V to 20V IN EXT V OSET f ADJ SV VOSET, COMP .. –0.3V to 2.7V COMP Operating Temperature Range (Note 2)..–40°C to 85°C VIN SGND Junction Temperature ... 125°C RUN/SS Storage Temperature Range .. –55°C to 125°C FCB PGOOD Peak Solder Reflow Body Temperature ... 245°C PGND VOUT LGA PACKAGE 104-LEAD (15mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 15°C/W, θJC = 6°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 1.7g orDer inForMaTionPART MARKING*PACKAGEMSLTEMPERATURE RANGEPART NUMBERPAD OR BALL FINISHDEVICEFINISH CODETYPERATING(SEE NOTE 2) LTM4600EV#PBF LTM4600EV Au (RoHS) e4 LGA 3 –40°C to 85°C LTM4600IV#PBF LTM4600IV • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: www.linear.com/leadfree • LGA and BGA Package and Tray Drawings: www.linear.com/packaging 4600fd 2 For more information www.linear.com/LTM4600 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Application Package Description Revision History Typical Application Related Parts
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