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Datasheet ADE9000 (Analog Devices) - 11

ПроизводительAnalog Devices
ОписаниеHigh Performance, Multiphase Energy, and Power Quality Measurement IC
Страниц / Страница72 / 11 — Data Sheet. ADE9000. Pin No. Mnemonic. Description
ВерсияA
Формат / Размер файлаPDF / 1.1 Мб
Язык документаанглийский

Data Sheet. ADE9000. Pin No. Mnemonic. Description

Data Sheet ADE9000 Pin No Mnemonic Description

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Data Sheet ADE9000 Pin No. Mnemonic Description
19, 20 VAN, VAP Analog Inputs, Channel VA. The VAP (positive) and VAN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4. 21, 22 VBN, VBP Analog Inputs, Channel VB. The VBP (positive) and VBN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4. 23, 24 VCN, VCP Analog Inputs, Channel VC. The VCP (positive) and VCN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4. 25 AVDDOUT 1.9 V Output of the Analog Low Dropout Regulator (LDO). Decouple AVDDOUT with a 0.1 µF ceramic capacitor in parallel with a 4.7 µF ceramic capacitor. Do not connect external active circuitry to this pin. 26 AGND Analog Ground Reference. Connect all grounds (GND, AGND, DGND, and REFGND) together at one point. 27 VDD Supply Voltage. The VDD pin provides the supply voltage. Decouple VDD to GND with a ceramic 0.1 µF capacitor in parallel with a 10 µF ceramic capacitor. 28 GND Supply Ground Reference. Connect all grounds (GND, AGND, DGND, and REFGND) together at one point. 29 CLKIN Crystal/Clock Input. Connect a crystal across CLKIN and CLKOUT to provide a clock source. Alternatively, an external clock can be provided at this logic input. 30 CLKOUT Crystal Output. Connect a crystal across CLKIN and CLKOUT to provide a clock source. When using CLKOUT to drive external circuits, connect an external buffer. 31 IRQ0 Interrupt Request Output. This pin is an active low logic output. See the Interrupts/Events section for information about events that trigger interrupts. 32 IRQ1 Interrupt Request Output. This pin is an active low logic output. See the Interrupts/Events section for information about events that trigger interrupts. 33 CF1 Calibration Frequency (CF) Logic Output 1. The CF1, CF2, CF3, and CF4 outputs provide power information based on the CFxSEL bits in the CFMODE register. Use these outputs for operational and calibration purposes. Scale the full-scale output frequency by writing to the CFxDEN registers (see the Digital to Frequency Conversion—CFx Output section). 34 CF2 CF Logic Output 2. This pin indicates CF2. 35 CF3/ZX CF Logic Output 3/Zero Crossing. This pin indicates CF3 or zero crossing. 36 CF4/EVENT/DREADY CF Logic Output 4/Event Pin/Data Ready. This pin indicates CF4, events, or when new data is ready. 37 SCLK Serial Clock Input for the SPI Port. All serial data transfers synchronize to this clock (see the Accessing On- Chip Data section). The SCLK pin has a Schmitt trigger input for use with a clock source that has a slow edge transition time, for example, optoisolator outputs. 38 MISO Data Output for the SPI Port. 39 MOSI Data Input for the SPI Port. 40 SS Slave Select for the SPI Port. EPAD Exposed Pad. Create a similar pad on the printed circuit board (PCB) under the exposed pad. Solder the exposed pad to the pad on the PCB to confer mechanical strength to the package and connect all grounds (GND, AGND, DGND, and REFGND) together at this point. Rev. A | Page 11 of 72 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION REVISION HISTORY TYPICAL APPLICATIONS CIRCUIT SPECIFICATIONS TIMING CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS ENERGY LINEARITY OVER SUPPLY AND TEMPERATURE ENERGY ERROR OVER FREQUENCY AND POWER FACTOR ENERGY LINEARITY REPEATABILITY RMS LINEARITY OVER TEMPERATURE AND RMS ERROR OVER FREQUENCY ENERGY AND RMS LINEARITY WITH INTEGRATOR ON ENERGY AND RMS ERROR OVER FREQUENCY WITH INTEGRATOR ON SIGNAL-TO-NOISE RATIO PERFORMANCE TEST CIRCUIT TERMINOLOGY THEORY OF OPERATION MEASUREMENTS Current Channel ADC_REDIRECT Multiplexer Current Channel Gain, xIGAIN IB Calculation Using ICONSEL High-Pass Filter Digital Integrator Phase Compensation Multipoint Phase and Gain Calibration Voltage Channel RMS and Power Measurements Total and Fundamental RMS Total and Fundamental Active Power Total and Fundamental Reactive Power Total and Fundamental Apparent Power No Load Detection, Energy Accumulation, and Power Accumulation Features No Load Detection Feature Energy Accumulation Power Accumulation Digital to Frequency Conversion—CFx Output Energy and Phase Selection Configuring the CFx Pulse Width CFx Pulse Sign Clearing the CFx Accumulator POWER QUALITY MEASUREMENTS Zero-Crossing Detection CF3/ZX Zero-Crossing Timeout Line Period Calculation Angle Measurement Phase Sequence Error Detection Fast RMS½ Measurement 10 Cycle RMS/12 Cycle RMS Dip and Swell Indication Overcurrent Indication Peak Detection Power Factor Total Harmonic Distortion (THD) Resampling 128 Points per Cycle Temperature WAVEFORM BUFFER INTERRUPTS/EVENTS ACCESSING ON-CHIP DATA SPI PROTOCOL OVERVIEW ADDITIONAL COMMUNICATION VERIFICATION REGISTERS CRC OF CONFIGURATION REGISTERS CONFIGURATION LOCK REGISTER MAP REGISTER DETAILS OUTLINE DIMENSIONS ORDERING GUIDE
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