Datasheet LT1009 (Analog Devices) - 6

LT1009 Series
PACKAGE DESCRIPTION H Package 2-Lead and 3-Lead TO-46 Metal Can
(Reference LTC DWG # 05-08-1340) .209 – .219 (5.309 – 5.537) .100 .178 – .195 .085 – .105 .050 (2.540) (4.521 – 4.953) (2.159 – 2.667) .050 (1.270) TYP (1.270) TYP .500 TYP (12.700) PIN 1 MIN REFERENCE FOR 3-LEAD PACKAGE ONLY PLANE SEATING* PLANE .025 45o (0.635) .036 – .046 .028 – .048 MAX (0.914 – 1.168) (0.711 – 1.219) .016 – .019** H02/03(TO-46) 0801 (0.406 – 0.483) DIA *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND .050" BELOW THE REFERENCE PLANE .016 – .024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610)
OBSOLETE PACKAGE MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660) 3.00 p 0.102 (.118 p .004) 0.52 (NOTE 3) 8 7 6 5 (.0205) REF 3.00 p 0.102 4.90 p 0.152 DETAIL “A” (.118 p .004) 0.889 p 0.127 0.254 (.193 p .006) (NOTE 4) (.035 p .005) (.010) 0o – 6o TYP GAUGE PLANE 1 2 3 4 5.23 3.20 – 3.45 0.53 p 0.152 (.206) (.126 – .136) (.021 p .006) 1.10 0.86 MIN (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) 0.42 p 0.038 0.65 (.0165 p .0015) (.0256) SEATING TYP BSC PLANE 0.22 – 0.38 0.1016 p 0.0508 (.009 – .015) RECOMMENDED SOLDER PAD LAYOUT (.004 p .002) TYP 0.65 MSOP (MS8) 0307 REV F (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 1009ff 6