Datasheet LT1722, LT1723, LT1724 (Analog Devices) - 16

LT1722/LT1723/LT1724
PACKAGE DESCRIPTION S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 ±.005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 ±.005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 ±.005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 s 45° .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0°– 8° TYP (0.101 – 0.254) (0.203 – 0.254) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303
MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F) 3.00 ± 0.102 0.889 ± 0.127 (.118 ± .004) 0.52 (.035 ± .005) (NOTE 3) 8 7 6 5 (.0205) REF 5.23 3.20 – 3.45 3.00 ± 0.102 (.206) 4.90 ± 0.152 (.126 – .136) DETAIL “A” (.118 ± .004) MIN 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 0.42 ± 0.038 0.65 (.0165 ± .0015) (.0256) 1 2 3 4 TYP BSC 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 RECOMMENDED SOLDER PAD LAYOUT (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE NOTE: 0.22 – 0.38 0.1016 ± 0.0508 1. DIMENSIONS IN MILLIMETER/(INCH) (.009 – .015) (.004 ± .002) TYP 0.65 MSOP (MS8) 0307 REV F 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. (.0256) MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE BSC 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 172234fb 16