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Datasheet LT1815, LT1816, LT1817 (Analog Devices) - 18

ПроизводительAnalog Devices
ОписаниеQuad 220MHz, 1500V/µs Operational Amplifiers with Programmable Supply Current
Страниц / Страница20 / 18 — PACKAGE DESCRIPTION. MS8 Package. 8-Lead Plastic MSOP. MS Package. …
Формат / Размер файлаPDF / 556 Кб
Язык документаанглийский

PACKAGE DESCRIPTION. MS8 Package. 8-Lead Plastic MSOP. MS Package. 10-Lead Plastic MSOP

PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP MS Package 10-Lead Plastic MSOP

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Микросхема Буферный усилитель, Dual 220MHz, 1500V/µs Operational Amplifiers with Programmable Supply Current
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LT1815/LT1816/LT1817
PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F) 3.00 p 0.102 (.118 p .004) 0.52 (NOTE 3) 8 7 6 5 (.0205) 0.889 p 0.127 REF (.035 p .005) DETAIL “A” 0.254 3.00 p 0.102 4.90 p 0.152 5.23 (.010) (.118 p .004) 0o – 6o TYP (.193 p .006) (.206) 3.20 – 3.45 (NOTE 4) MIN (.126 – .136) GAUGE PLANE 0.53 p 0.152 1 2 3 4 (.021 p .006) 0.42 p 0.038 0.65 1.10 0.86 (.0165 p .0015) (.0256) (.043) (.034) TYP BSC DETAIL “A” MAX REF RECOMMENDED SOLDER PAD LAYOUT 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 p 0.0508 (.009 – .015) (.004 p .002) TYP 0.65 MSOP (MS8) 0307 REV F (.0256) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD 2. DRAWING NOT TO SCALE FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE (.004") MAX
MS Package 10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev E) 3.00 ± 0.102 (.118 ± .004) 0.889 ± 0.127 0.497 ± 0.076 (.035 ± .005) (NOTE 3) (.0196 ± .003) 10 9 8 7 6 REF 5.23 3.20 – 3.45 3.00 ± 0.102 (.206) 4.90 ± 0.152 MIN (.126 – .136) DETAIL “A” (.118 ± .004) (.193 ± .006) 0.254 (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 0.305 ± 0.038 0.50 (.0120 ± .0015) (.0197) 1 2 3 4 5 TYP BSC 0.53 ± 0.152 RECOMMENDED SOLDER PAD LAYOUT (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.1016 ± 0.0508 (.007 – .011) (.004 ± .002) 0.50 TYP MSOP (MS) 0307 REV E (.0197) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. 2. DRAWING NOT TO SCALE INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 181567fb 18
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