Datasheet LT1126, LT1127 (Analog Devices) - 9

LT1126/LT1127
U PACKAGE DESCRIPTIO N8 Package 8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510) .400* (10.160) .300 – .325 .045 – .065 .130 ± .005 MAX (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) 8 7 6 5 .065 .255 ± .015* (1.651) (6.477 ± 0.381) .008 – .015 TYP .120 (0.203 – 0.381) (3.048) .020 +.035 MIN (0.508) 1 2 3 4 .325 –.015 MIN .100 .018 ± .003 +0.889 8.255 (2.54) (0.457 ± 0.076) ( ) –0.381 N8 1002 BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 ±.005 NOTE 3 .050 BSC .010 – .020 × 8 7 6 5 45° .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0 (0.101 – 0.254) (0.203 – 0.254) °– 8° TYP .245 MIN .160 ±.005 .150 – .157 .228 – .244 (3.810 – 3.988) .016 – .050 (5.791 – 6.197) .014 – .019 .050 NOTE 3 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) .030 ±.005 2. DRAWING NOT TO SCALE TYP 1 2 3 4 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. RECOMMENDED SOLDER PAD LAYOUT MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303
J Package 14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .785 (19.939) .200 .005 MAX .300 BSC (0.127) (5.080) (7.62 BSC) MAX MIN 14 13 12 11 10 9 8 .015 – .060 (0.381 – 1.524) .025 .220 – .310 (0.635) (5.588 – 7.874) RAD TYP .008 – .018 0° – 15° (0.203 – 0.457) 1 2 3 4 5 6 7 .045 – .065 .100 .125 (1.143 – 1.651) (2.54) (3.175) BSC .014 – .026 MIN NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (0.360 – 0.660) J14 0801 OR TIN PLATE LEADS
OBSOLETE PACKAGE
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