Datasheet LT1078, LT1079 (Analog Devices) - 19

LT1078/LT1079
U PACKAGE DESCRIPTIO J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) 0.405 (10.287) 0.200 0.005 0.300 BSC MAX CORNER LEADS OPTION (5.080) (0.127) (4 PLCS) (0.762 BSC) MAX MIN 8 7 6 5 0.015 – 0.060 0.023 – 0.045 (0.381 – 1.524) 0.025 0.220 – 0.310 (0.584 – 1.143) (0.635) (5.588 – 7.874) HALF LEAD RAD TYP OPTION 0.008 – 0.018 0° – 15° 0.045 – 0.068 (0.203 – 0.457) (1.143 – 1.727) 1 2 3 4 FULL LEAD 0.045 – 0.065 OPTION 0.125 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (1.143 – 1.651) 3.175 OR TIN PLATE LEADS MIN 0.014 – 0.026 0.100 (0.360 – 0.660) (2.54) BSC J8 1298
J Package 14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) 0.785 (19.939) 0.200 0.005 0.300 BSC MAX (5.080) (0.127) (0.762 BSC) MAX MIN 14 13 12 11 10 9 8 0.015 – 0.060 (0.381 – 1.524) 0.025 0.220 – 0.310 (0.635) (5.588 – 7.874) RAD TYP 0.008 – 0.018 0° – 15° (0.203 – 0.457) 1 2 3 4 5 6 7 0.045 – 0.065 0.100 0.125 (1.143 – 1.651) (2.54) (3.175) BSC 0.014 – 0.026 MIN NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (0.360 – 0.660) J14 1298 OR TIN PLATE LEADS
OBSOLETE PACKAGES N8 Package 8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510) 0.400* (10.160) 0.300 – 0.325 0.045 – 0.065 0.130 ± 0.005 MAX (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) 8 7 6 5 0.065 0.255 ± 0.015* (1.651) (6.477 ± 0.381) 0.009 – 0.015 TYP 0.125 (0.229 – 0.381) (3.175) 0.020 +0.035 MIN (0.508) 0.325 1 2 3 4 –0.015 0.100 MIN 0.018 ± 0.003 +0.889 8.255 (2.54) (0.457 ± 0.076) ( ) –0.381 N8 1098 BSC *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm) 10789fe Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19