Datasheet LTC2066, LTC2067 (Analog Devices) - 23

LTC2066/LTC2067
PACKAGE DESCRIPTION SC6 Package 6-Lead Plastic SC70
(Reference LTC DWG # 05-08-1638 Rev B) 0.47 0.65 1.80 – 2.20 MAX REF (NOTE 4) 1.00 REF INDEX AREA 1.15 – 1.35 (NOTE 6) 1.80 – 2.40 2.8 BSC 1.8 REF (NOTE 4) PIN 1 RECOMMENDED SOLDER PAD LAYOUT 0.15 – 0.30 0.65 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.10 – 0.40 0.80 – 1.00 0.00 – 0.10 REF 1.00 MAX GAUGE PLANE 0.15 BSC 0.26 – 0.46 SC6 SC70 1205 REV B 0.10 – 0.18 (NOTE 3) NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE INDEX AREA 7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70 8. JEDEC PACKAGE REFERENCE IS MO-203 VARIATION AB Rev A For more information www.analog.com 23 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Typical Application Related Parts