Datasheet LTC6255, LTC6256, LTC6257 (Analog Devices) - 19

LTC6255/LTC6256/LTC6257
PACKAGE DESCRIPTION TS8 Package 8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637 Rev A) 2.90 BSC 0.40 0.65 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.22 – 0.36 0.65 BSC PER IPC CALCULATOR 8 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.95 BSC TS8 TSOT-23 0710 REV A (NOTE 3) NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 Rev E For more information www.analog.com 19 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information 5V Electrical Characteristics 1.8V Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Schematic Operation Applications Information Typical Applications Package Description Typical Application Related Parts