Datasheet LT3514 (Analog Devices) - 23

LT3514
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. FE Package 24-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1771 Rev B)
Exposed Pad Variation AA
7.70 – 7.90* 3.25 (.303 – .311) (.128) 3.25 (.128) 24 23 22 21 20 19 18 17 16 15 14 13 6.60 ±0.10 2.74 (.108) 4.50 ±0.10 6.40 2.74 SEE NOTE 4 (.252) (.108) 0.45 ±0.05 BSC 1.05 ±0.10 0.65 BSC RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 8 9 10 11 12 1.20 4.30 – 4.50* (.047) 0.25 (.169 – .177) MAX REF 0° – 8° 0.65 0.09 – 0.20 0.50 – 0.75 (.0256) 0.05 – 0.15 (.0035 – .0079) (.020 – .030) BSC (.002 – .006) 0.195 – 0.30 FE24 (AA) TSSOP REV B 0910 (.0077 – .0118) TYP NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE MILLIMETERS FOR EXPOSED PAD ATTACHMENT 2. DIMENSIONS ARE IN (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 3. DRAWING NOT TO SCALE 3514fa For more information www.linear.com/LT3514 23 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts