Datasheet ADP2164 (Analog Devices) - 5

Data Sheet ADP2164 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is measured using natural convection on a JEDEC 4-layer PVIN, VIN, SW −0.3 V to +7 V board. The exposed pad is soldered to the printed circuit board FB, SYNC, TRK, RT, EN, PGOOD −0.3 V to +7 V with thermal vias. PGND to GND −0.3 V to +0.3 V Operating Junction Temperature Range −40°C to +125°C
Table 3. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type
θ
JA Unit
Soldering Conditions JEDEC J-STD-020 16-Lead LFCSP 38.3 °C/W Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 5 of 19 Document Outline Features Applications Typical Applications Circuit General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Functional Block Diagram Theory of Operation Control Scheme Slope Compensation Precision Enable/Shutdown Integrated Soft Start Oscillator and Synchronization Power Good Current Limit and Short-Circuit Protection Overvoltage Protection (OVP) Undervoltage Lockout (UVLO) Thermal Shutdown Applications Information ADIsimPower Design Tool Output Voltage Selection Inductor Selection Output Capacitor Selection Input Capacitor Selection Voltage Tracking Coincident Tracking Ratiometric Tracking Applications Circuits Outline Dimensions Ordering Guide