LTM8071 ABSOLUTE MAXIMUM RATINGSPIN CONFIGURATION(Notes 1, 2, 4) TOP VIEW VIN, RUN Voltage ..65V GND RT RUN PG Voltage ..42V A AUX, VOUT, BIAS Voltage ..19V TR/SS BANK 2 FB, TR/SS Voltage...4V SYNC B PG SHARE VIN SYNC Voltage ..6V C FB Maximum Internal Temperature .. 125°C D AUX Storage Temperature.. –50°C to 125°C BIAS E BANK 1 Peak Reflow Solder Body Temperature ...250°C F GND G H J BANK 3 VOUT K 1 2 3 4 5 6 7 8 BGA PACKAGE 80-LEAD (11.25mm × 9mm × 3.32mm) TJMAX = 125°C, θJA = 18°C/W, θJCbottom = 3.4°C/W, θJCtop = 8.4°C/W, θJB = 2.8°C/W, WEIGHT = 1.0g θ VALUES DETERMINED PER JEDEC 51-9, 51-12 ORDER INFORMATIONPART MARKING*PACKAGEMSLPART NUMBERTERMINAL FINISHDEVICEFINISH CODETYPERATINGTEMPERATURE RANGE (NOTE 3, 4) LTM8071EY#PBF SAC305 (RoHS) e1 LTM8071IY#PBF LTM8071 BGA 3 –40°C to 125°C LTM8071IY SnPb (63/37) e0 • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the Procedures shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings Rev 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photos Package Description Typical Application Related Parts
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