Datasheet LTM8065 (Analog Devices) - 2

LTM8065
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
VIN, RUN, PG Voltage .. 42V TOP VIEW AUX, VOUT, BIAS Voltage .. 19V FB, TR/SS Voltage ... 4V GND BIAS PG GND RT GND SYNC Voltage .. 6V A Maximum Internal Temperature .. 125°C FB AUX SYNC TR/SS RUN B Storage Temperature .. –55°C to 125°C BANK 2 Peak Reflow Solder Body Temperature ... 260°C VIN C D BANK 1 GND E F BANK 3 VOUT 1 2 3 4 5 6 BGA PACKAGE 36-LEAD (6.25mm × 6.25mm × 2.32mm) BGA PACKAGE TJMAX = 125°C, θJA = 21°C/W, θJCbottom = 5.9°C/W θJCtop = 36.5°C/W, θJB = 6.3°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8065EY#PBF SAC305 (RoHS) LTM8065 e1 BGA 3 –40°C to 125°C LTM8065IY#PBF • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev.B 2 For more information www.analog.com